The Taiwanese semiconductor manufacturer, MediaTek, has announced its first chipset with several brands, but despite their popularity, they have never had for mmWave 5G, which some U.S. and Japanese carriers use.
While most recent smartphones launched in the U.S. have 5G, not all work with the existing 5G technologies. In some cases, the buyer has to do due diligence to determine which model works with the 5G network available in their area of residence. Sometimes, models that certain 5G technologies are only available via a specific carrier, so those who need such phones have to purchase them through such companies.
The new MediaTek chipset is the Dimensity 1050 and it has for both mmWave and sub-6GHz 5G technologies, a first for a MediaTek chipset. By ing both 5G technologies using 3CC carrier aggregation, Built on TSMC's 6nm node, the chipset has eight U cores. In addition to ing both 5G technologies, the chip also has for True Dual 5G SIM and Wi-Fi 6E (2x2 MIMO).
Dimensity 1050 Technical Specifications
For its U, the Dimensity 1050 has two Cortex-A78 cores clocked at 2.5GHz and six Cortex-A55 cores clocked at 2.0GHz. The U is paired with an Arm Mali-G610 MC3 GPU for graphics and a MediaTek APU 550 for handling artificial intelligence tasks. It also has MediaTek's HyperEngine 5.0, the same game engine inside the more powerful Dimensity 1300 processor. The game engine features AI-driven Variable Rate Shading (AI-VRS), Frame Rate Smoother, and an AI-driven denoiser for ray tracing. Furthermore, the chipset has for LPDDR5 RAM and UFS 3.1 storage. It can also FHD+ displays with a refresh rate of up to 144Hz and a maximum camera resolution of 108MP. In addition to Wi-Fi 6E, it also has Bluetooth 5.2 and dual-frequency GPS.
In MediaTek's Dimensity 1000 series hierarchy, the Dimensity 1050 sits behind the Dimensity 1100 announced in Jan. 2021. However, it is ranked higher than the Dimensity 1000C that debuted in the T-Mobile version of the LG Velvet 5G. DigitalTrends have reported that MediaTek has completed the required certification for the chip's use by U.S. network operators. It is also expected to receive certification in Japan in July. In addition, MediaTek has revealed that phones powered by the chip are expected to launch in the third quarter of 2022 but didn't disclose the brands that will use the chip.
Alongside the Dimensity 1050, MediaTek also announced two other less powerful chips. First, the 6nm Dimensity 930 with two Cortex-A78 cores clocked at 2.2GHz, six Cortex-A55 cores clocked at 2.0GHz and an IMG BXM-8-256 GPU, and the HyperEngine 3.0 Lite game engine. The last chip is the Helio G99, also built on the 6m node but a 4G chip, which uses two older Cortex-A76 cores clocked at 2.2GHz and paired with six Cortex-A55 cores clocked at 2.0GHz. The GPU is an Arm Mali-G57 MC2 and the game engine is the HyperEngine 2.0 Lite. The Dimensity 930 will be available in phones in Q2 2022, while the Helio G99 will be available in the third quarter.
Source: MediaTek, DigitalTrends